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www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 1/17 1.nov.2012 rev.001 tsz22111 ? 14? 001 datashee t operational amplifiers low noise operational amplifier lm4559f general description ba4559 is dual operational amplifier with high gain and wide bandwidth. it has good performance of input referred noise voltage(5 hznv/ ) and total harmonic distortion(0.002%). these are suitable for audio applications. features ? high voltage gain ? high slew rate ? low noise voltage ? low distortion ? wide common-mode voltage range ? low power consumption application ? audio application ? general purpose key specifications ? wide operating supply voltage 4v to 18v ? wide temperature range: -40c to +85c ? high voltage gain 110db (typ.) ? high unity gain bandwidth 3.3mhz (typ.) ? high slew rate 3.5v/s (typ.) ? low noise voltage 0.7vrms (typ.) package w(typ.) xd(typ.) xh(max.) sop8 5.00mm x 6.20mm x 1.71mm block diagram figure 1. simplified schematic (1 channel only) product structure silicon monolithic integrated circuit this product is not designed to be protected against radioactive rays. in in vou t vcc vee
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 2/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f pin configuration sop8 pin no. symbol 1 out1 2 -in1 3 +in1 4 vee 5 +in2 6 -in2 7 out2 8 vcc ordering information l m 4 5 5 9 f - e 2 part number lm4559f package f:sop8 packaging and forming specification e2: embossed tape and reel (sop8) line-up topr package operable part number -40c to +85c sop8 reel of 2500 LM4559F-E2 absolute maximum ratings (ta=25c) parameter symbol ratings unit supply voltage vcc ? vee +36 v power dissipation pd 690 *1*2 mw differential input voltage *3 vid 36 v input common-mode voltage range vicm (vee - 0.3) to (vee + 36) v operating supply voltage vopr 4 to 18 v operating temperature topr - 40 to +85 c storage temperature tstg - 55 to +150 c maximum junction temperature tjmax +150 c note: absolute maximum rating of each item indicates the condition which must not be exceeded. application of voltage in excess of absolute maximum rating or usage out of absolute maximum rated temperature environment may cause deterioration of characteristics. *1 when used at temperature above ta 25 , reduce by 5.52mw/ . *2 mounted on a fr4 glass epoxy pcb(70mm70mm1.6mm). *3 differential input voltage is the voltage difference between inverting input and non-inverting input. input terminal voltage is set to more than vee. 45 36 27 18 ch1 - + ch2 + - out1 -in1 +in1 vee out2 -in2 +in2 vcc
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 3/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f electrical characteristics: lm4559f (unless otherwise s pecified vcc=+15v, vee=-15v) parameter symbol temperature range limits unit condition min. typ. max. input offset voltage *4*5 vio 25c - 0.5 1.5 mv out=0v input offset current *4*5 iio 25c - 5 100 na out=0v input bias current *4*5 ib 25c - 40 200 na out=0v input common-mode voltage range vicm 25c 12 13 - v maximum output voltage *5 vom 25c 12 13 - v rl 2k ? 11 12.5 - rl = 600 ? large signal voltage gain *5 av 25c 20 300 - v/mv out=10v, rl=2k ? 25c 86 110 - db supply current *5 icc 25c - 3.3 5.0 ma rl= , all op-amps full range - - 6.5 maximum output swing bandwidth bom 25c - 32 - khz out p-p = 20v, rl=2k ? unity gain frequency f t 25c - 3.3 - mhz rl=2k ? gain band width gbw 25c - 4 - mhz rl=2k ? , f=1mhz phase margin 25c - 50 - deg rl=2k ? common-mode rejection ratio cmrr 25c 80 100 - db out=0v power supply rejection ratio psrr 25c 82 100 - db out=0v equivalent input noise voltage vn 25c - 0.7 - vrms av= 40db, rs=1k ? f=20hz to 20khz - 5 - hznv/ vicm=0v, f=1khz total harmonic distortion+ noise t hd+n 25c - 0.002 - % f=1khz, rl=2k ? , channel separation cs 25c - 110 - db av=40db, rs=1k ? f=10khz slew rate sr 25c 1.5 3.5 - v/s rl=2k ? , cl=100pf *4 absolute value. *5 full range: ta=-40c to +85c
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 4/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f description of electri cal characteristics described here are the terms of electric characteristics used in this datasheet. items and symbols used are also shown. note that item name, symbol and their meaning may differ from those on other manufacturer?s document or general documents. 1. absolute maximum ratings absolute maximum rating items indicate the condition which must not be exceeded. app lication of voltage in excess of absolute maximum rating or use out of absolute maximum rated temperature environment may cause deterioration of characteristics. 1.1 supply voltage (vcc ? vee) indicates the maximum voltage that can be applied between the positive power supply terminal and negative power supply terminal without deterioration or destruct ion of characteristics of internal circuit. 1.2 differential input voltage (vid) indicates the maximum voltage that can be applied between non-inverting terminal and inverting terminal without deterioration and destruction of characteristics of ic. 1.3 input common-mode voltage range (vicm) indicates the maximum voltage that can be applied to the non-inverting terminal and inverting terminal without deterioration or destruction of characteristics. input common-mode voltage range of the maximum ratings not assures normal operation of ic. when normal operation of ic is desired, the input common-mode voltage of characteristics item must be followed. 1.4 power dissipation (pd) indicates the power that can be consumed by the ic when mo unted on a specific board at am bient temperature 25c (normal temperature). as for the packaged product, pd is determined by the temperature that can be permitted by the ic in the package (maximum junction temperature) a nd the thermal resistance of the package 2. electrical characteristics item 2.1 input offset voltage (vio) indicates the voltage difference between non-inverting terminal and inverting terminal. it can be translated into the input voltage difference required for setting the output voltage to 0 v. 2.2 input offset current (iio) indicates the difference of input bias current bet ween non-inverting terminal and inverting terminal. 2.3 input bias current (ib) indicates the current that flows into or out of the input terminal. it is defined by the average of input bias currents at non-inverting and inverting terminals. 2.4 input common-mode voltage range (vicm) indicates the input voltage range where ic operates normally. 2.5 maximum output voltage (vom) indicates the voltage range that the ic c an output under specified load condition. it is typically divided into high-level output voltage and low-level output voltag e. high-level output voltage indicate s the upper limit of output voltage. low-level output voltage indicates the lower limit. 2.6 large signal voltage gain (av) indicates the amplification rate (gai n) of the output voltage against the voltage difference between the non-inverting and inverting terminals. it is normally the amplification rate (gain) with reference to dc voltage. av = (output voltage fluctuation) / (input offset fluctuation) 2.7 supply current (icc) indicates the current that flows within the ic under specified no-load conditions. 2.8 maximum output swing bandwidth (bom) indicates the range of frequency within which the maximum output voltage swing. 2.9 unity gain frequency (f t ) indicates the frequency where the voltage gain of op-amp is 1. 2.10 gain band width (gbw) indicates to multiply by the frequency and the gai n where the voltage gain decreases 6db/octave. 2.11 phase margin ( ) indicates the margin of phase from 180 de gree phase lag at unity gain frequency. 2.12 common-mode rejection ratio (cmrr) indicates the ratio of fluctuation of input offset vo ltage when the input common-mode voltage is changed. it is normally the fluctuation of dc. cmrr = (change of input common-mode voltage)/(input offset fluctuation) 2.13 power supply rejection ratio (psrr) indicates the ratio of fluctuation of input offset voltage when supply voltage is changed. it is normally the fluctuation of dc. psrr= (change of power supply volta ge)/(input offset fluctuation) 2.14 equivalent input noise voltage (vn) indicates a noise voltage generated inside the operati onal amplifier reflected back to an ideal voltage source connected in series with the input terminal. 2.15 total harmonic distortion + noise (thd+n) indicates the fluctuation of input offset voltage or that of output vo ltage with reference to the change of output voltage of driven channel.
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 5/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f 2.16 channel separation (cs) indicates the fluctuation in the output vo ltage of the driven channel with reference to the change of output voltage of the channel which is not driven. 2.17 slew rate (sr) indicates the ratio of the change in output voltage wi th time when a step input signal is applied.
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 6/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f typical performance curves lm4559f -20 -15 -10 -5 0 5 10 15 20 0 5 10 15 20 supply voltage [v] maximum output voltage [ v 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 0 5 10 15 20 supply voltage [v] supply current [ma] -40c 25c 85c figure 3. supply current ? supply voltage 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 -50-25 0 255075100 ambient temperature [c] supply current [ma] figure 4. supply current ? ambient temperature (vcc/vee=15v) figure 5. maximum output voltage ? supply voltage (rl=2k ? ) -40c 25c 0 200 400 600 800 0255075100 ambient temperature [ ] power dissipation [mw] figure 2. derating curve 85 (*)the data above is measurement value of typical sample, it is not guaranteed. -40c 25c 85c lm4559f 85c
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 7/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f typical performance curves (reference data) ? continued lm4559f -6 -4 -2 0 2 4 6 -50 -25 0 25 50 75 100 ambient temperature [c] input offset voltage [mv] -6 -4 -2 0 2 4 6 -15 -10 -5 0 5 10 15 input common-mode voltage [v] input offset voltage [mv] figure 8. input offset voltage ? ambient temperature (vcc/vee=15v) figure 9. input offset voltage ? input common-mode voltage (vcc/vee=15v) (*)the data above is measurement value of typical sample, it is not guaranteed. 25c -40c 85c figure 7. maximum output swing bandwidth ? frequency (vcc/vee=15v, ta=25c, rl=2k ? ) 1 10 10 2 10 3 10 4 10 5 figure 6. maximum output voltage ? ambient temperature (vcc/vee=15v, rl=2k ? ) -20 -15 -10 -5 0 5 10 15 20 -50-25 0 255075100 ambient temperature [ ] maximum output voltage [v] . 0 5 10 15 20 25 30 frequency [khz] output voltage swing [v]
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 8/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f typical performance curves (reference data) ? continued lm4559f 0 1 2 3 4 5 6 -50-250255075100 ambient temperature [c] slew rate l-h [v/s] figure 11. common mode rejection ratio ? ambient temperature (vcc/vee=15v) 80 85 90 95 100 105 110 115 120 -50-250 255075100 ambient temperature [c] power supply rejection ratio [db] figure 12. power supply rejection ratio ? ambient temperature figure 13. slew rate l-h ? ambient temperature (vcc/vee=15v, rl=2k ? , cl=100pf) (*)the data above is measurement value of typical sample, it is not guaranteed. figure 10. large signal voltage gain ? ambient temperature (vcc/vee=15v, rl=2k ? ) 90 100 110 120 130 140 150 -50-25 0 255075100 ambient temperature [ ] large signal voltage gain [db] . 100 110 120 130 140 150 160 -50-25 0 255075100 ambient temperature [c] common mode rejection ratio [db] .
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 9/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f typical performance curves (reference data) - continued lm4559 0 25 50 75 100 125 150 -50 -25 0 25 50 75 100 ambient temperature [c] input bias current [na] 0 1 2 3 4 5 6 -50 -25 0 25 50 75 100 ambient temperature [c] slew rate h-l [v/s] figure 14. slew rate h-l ? ambient temperature (vcc/vee=15v, rl=2k ? , cl=100pf) -30 -20 -10 0 10 20 30 -50-250 255075100 ambient temperature [c] input offset current [na] figure 17. input offset current ? ambient temperature (vcc/vee=15v) figure 16. input bias current ? ambient temperature (vcc/vee=15v) (*)the data above is measurement value of typical sample, it is not guaranteed. 0 20 40 60 80 100 1.e+00 1.e+01 1.e+02 1.e+03 1.e+04 1.e+05 frequency [khz] gain[db] 0 40 80 120 160 200 phase [deg] phase gain figure 15. voltage gain ? phase ? frequency (vcc/vee=15v, rl=2k ? ) 0.1 1 10 10 2 10 3 10 4
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 10/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f typical performance curves (reference data) - continued lm4559 0.0001 0.001 0.01 0.1 1 0.01 0.1 1 10 100 output voltage [vrm s ] total harmonic distortion [%] (*)the data above is measurement value of typical sample, it is not guaranteed. figure 19. equivalent input noise voltage - frequency (vcc/vee=15v, ta=25c, av=40db) 0 10 20 30 40 50 60 frequency [khz] equivalent input noise voltage [nv/ hz] 1 10 10 2 10 3 10 4 10 5 figure 20. equivalent input noise voltage ? supply voltage (ta=25c, din audio) 0 0.2 0.4 0.6 0.8 1 0 5 10 15 20 supply voltage [v] equivalent input noise voltage [vrms] figure 18. total harmonic distortion - output voltage (vcc/vee=15v, rl=2k ? ) 20hz 1khz 20khz
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 11/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f application information null method condition for test circuit 1 vcc, vee, ek, vicm unit:v parameter vf s1 s2 s3 vcc vee ek vicm calculation input offset voltage vf1 on on off 15 -15 0 0 1 large signal voltage gain vf2 on on on 15 -15 -10 0 2 vf3 10 common mode rejection ratio (input common-mode voltage range) vf4 on on off 15 -15 0 -10 3 vf5 10 power supply rejection ratio vf6 on on off 4 -4 0 0 4 vf7 18 -18 calculation 1. input offset voltage (vio) 2. large signal voltage gain (av) 3. common mode rejection ratio (cmrr) 4. power supply rejection ratio (psrr) vio |vf1| = 1+rf/rs [v] a v |vf2-vf3| = ? ek (1+rf/rs) [db] 20log cmrr |vf4 - vf5| = ? vicm (1+rf/rs) [db] 20log psrr |vf6 - vf7| = ? vcc (1+ rf/rs) [db] 20log figure 21. test circuit 1 vcc rf=50k ri=10k 0.1f rs=50 rl sw3 500k 500k 0.1f e k 15v dut vee vrl 50k vicm sw1 0.1f ri=10k vo vf rs=50 1000pf 0.1f -15v null
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 12/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f switch condition for test circuit 2 sw no. sw1 sw2 sw3 sw4 sw5 sw 6 sw7 sw8 sw9 sw10 sw11 sw12 supply current off off on off on off off off off off off off maximum output voltage rl=2k ? off on off off on off off on off off on off slew rate off off on off off off on off on off off on maximum frequency on off off on on off off off on off off on v vcc vee r2=100k r1=1k vcc vee out1 =1vrms v vin out2 cs=20log 100out1 r2=100k r1//r2 r1//r2 r1=1k figure 24. test circuit 3 (channel separation) vh vl input wave t input voltage vh vl t v output wave sr= v/ t t output voltage 90% 10% figure 23. slew rate input output wave sw1 sw2 sw9 sw10 sw11 sw8 sw6 sw7 cl sw12 sw4 r1 1k r2 100k rl vee vcc=30v vo vin- vin+ sw3 figure 22. test circuit2 sw5 out2
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 13/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f application example voltage follower inverting amplifier non-inverting amplifier figure 26. inverting amplifier circuit figure 27. non-inverting amplifier circuit for inverting amplifier, in is amplified by a voltage gain decided by the ratio of r1 and r2. the out-of-phase output voltage is shown in the next expression. out=-(r2/r1) ?in this circuit has input impedance equal to r1. for non-inverting amplifier, in is amplified by a voltage gain decided by the ratio of r1 and r2. out is in-phase with in and is shown in the next expression. out=(1+r2/r1) ?in effectively, this circuit has high input impedance since its input side is the same as that of the operational amplifier. figure 25. voltage follower voltage gain is 0db. using this circuit, the output voltage (out) is controlled to be equal to the input voltage (in). this circuit also stabilizes out due to high input impedance and low output impedance. computation for out is shown below. out=in vee out in vcc r2 r1 vee r1//r2 in out vcc vee r2 vcc in out r1
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 14/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f power dissipation power dissipation (total loss) indicates the power that the ic can consume at ta=25c (normal temperature). as the ic consumes power, it heats up, causing its temperature to be higher than the ambient temperature. the allowable temperature that the ic can accept is limited. this depends on the circuit configuration, manufacturing process, and consumable power. power dissipation is determined by the allowable temperature within the ic (maximum junction temperature) and the thermal resistance of the package used (heat dissipation capability). maximum junction temperature is typically equal to the maximum storage temperature. the heat gener ated through the consumption of power by the ic radiates from the mold resin or lead frame of the package. thermal resistance, represented by the symbol jac/w, indicates this heat dissipation capability. similarly, the temperature of an ic inside its package can be estimated by thermal resistance. figure 28 (a) shows the model of the thermal resistance of a package. the equation below shows how to compute for the thermal resistance ( ja), given the ambient temperature (ta), maxi mum junction temperature (tjmax), and power dissipation (pd). ja = (tjmax ta) / pd c/w ????? ( ) the derating curve in figure 28 (b) indicates the power that the ic can consume with reference to ambient temperature. power consumption of the ic begins to attenuate at certai n temperatures. this gradient is determined by thermal resistance ( ja), which depends on the chip size, power consumpti on, package, ambient temperature, package condition, wind velocity, etc. this may also vary even when the sa me of package is used. thermal reduction curve indicates a reference value measured at a specified condition. figure 29 (c) shows an ex ample of the derating curve for lm4559. when using the unit above ta=25c, subtract the val ue above per c. permissible dissipation is the value when fr4 glass epoxy board 70mm 70mm 1.6mm (cooper foil area below 3%) is mounted 5.52 mw/c (c) lm4559 figure 28. thermal resistance and derating curve 0 50 75 100 125 150 25 p1 p2 pd (max) lsi M [w] ' ja2 ' ja1 tj ' (m ax ) ja2 < ja1 ?? ta [ ] ja2 ja1 tj (m ax ) ambient temperature power dissipation of lsi (b) derating curve a mbient temperature ta [ c ] chip surface temperature tj[ c ] (a) thermal resistance ja=(tjmax-ta)/pd c/w 0 200 400 600 800 0255075100 ambient temperature [c] power dissipation [mw] lm4559f figure 29. derating curve
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 15/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f operational notes 1) processing of unused circuit it is recommended to apply the connection (see figure 30.) and set the non-inverting input terminal at a potent ial within the input common-mode voltage range (vicm) for any unused circuit. 2) applied voltage to the input terminal for normal circuit operation of voltage comparator, please input a voltage for its input terminal within input common-mode voltage range (vicm). then, regardless of power supply voltage, (vee) ? 0.3v can be applied to input terminals without deterioration or destruction of its characteristics. 3) operating power supply (split power supply/single power supply) the voltage comparator operates if a certain level of voltage is applied between vcc and vee. therefor e, the operational amp lifier can be operated under single power supply or split power supply. 4) power dissipation (pd) if the ic is used under excessive power dissipation, an increas e in the chip temperature will cause deterioration of the electrical characteristics of ic. as an example, reduction of current capability may happen. take consideration of the effective power dissipation and thermal design with a sufficient margin. pd is referenced to the provided power dissipation curve. 5) short circuits between pins and incorrect mounting when mounting the ic on a printed circuit board, take notice of the direction and positi on of the ic. if ic is mounted erroneously, it may be damaged. also, when a foreign obje ct is inserted between out puts, between output and vcc terminal, or between output and vee terminal, it causes short circuit which may damage the ic. 6) usage under strong electromagnetic field be careful when using the ic under strong elec tromagnetic field becaus e it may malfunction. 7) usage of ic when pressure is applied to the ic through warp on the print ed circuit board, the characteri stics may fluctuate due to the piezo effect. be careful with the warp on the printed circuit board. 8) testing ic on the application board when testing ic on the application board, in cases where the capacitor is connected to low impedance, make sure to discharge per process because there is a possibility that t he ic may be damaged due to stress. when removing ic from the application board, it is ess ential to cut the supply voltage. as a counterm easure against the static electricity, observe proper grounding during fabrication process and take due care when carrying and storing it. 9) the ic destruction caused by capacitive load the ic may be damaged when vcc terminal and vee terminal is shorted with the charged output terminal capacitor. when ic is used as an operational amplif ier or as an application circuit where os cillation is not activated by an output capacitor, output capacitor must be kept below 0.1 f in order to prevent the damage mentioned above. 10) decoupling capacitor insert a decoupling capacitor between vcc and vee for stable operation of operational amplifier. status of this document the japanese version of this document is the formal specification. a customer may use this translation version only for reference to help in reading the formal version. if there are any differences in the transplanted versio n of this document, the formal version takes priority. connect to vicm vcc vee vicm - + application circuit for unused op-amp figure 30. the example of vee
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 16/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f physical dimensions tape and reel information marking diagram land pattern data all dimensions in mm pkg land pitch e land space mie land length ? 2 land width b2 sop8 1.27 4.60 1.10 0.76 product name package type marking lm4559 f sop8 4559 b 2 mie e ?2 sop8(top view) part number marking lot number 1pin mark ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper left when you hold reel on the left hand and you pull out the tape on the right hand 2500pcs e2 () direction of feed reel 1pin (unit : mm) sop8 0.90.15 0.3min 4 + 6 ? 4 0.17 +0.1 - 0.05 0.595 6 43 8 2 5 1 7 5.00.2 6.20.3 4.40.2 (max 5.35 include burr) 1.27 0.11 0.420.1 1.50.1 s 0.1 s
datasheet www.rohm.com tsz02201-0rar1g200580-1-2 ?2012 rohm co., ltd. all rights reserved. 17/17 1.nov.2012 rev.001 tsz22111 ? 15? 001 lm4559f revision history date revision changes 30.nov.2012 001 new release
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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